This service includes product wafer-level circuit probing (CP) and package-level final test (FT), program development, hardware design testing, as well as manufacturing and production test management.
Working with us, you can leverage our extensive experience in various application products and IPs test, including DDR, MIPI, PCIe, USB, high-speed SerDes, CoWoS HBM and High-power,
High-speed Interface Test Solutions, etc.